Independently Published

ADVANCED SEMICONDUCTOR PACKAGING FOR AI CHIPS: HBM Memory, Chiplet Integration, 2.5D and 3D Packaging, Hybrid Bonding, Thermal Design, Package Reliability

Name: ADVANCED SEMICONDUCTOR PACKAGING FOR AI CHIPS: HBM Memory, Chiplet Integration, 2.5D and 3D Packaging, Hybrid Bonding, Thermal Design, Package Reliability
Brand: Independently Published
SKU: 2784ca36192ecb4a1e897f6469c478f0

1/1

Abbildung von ADVANCED SEMICONDUCTOR PACKAGING FOR AI CHIPS: HBM Memory, Chiplet Integration, 2.5D and 3D Packaging, Hybrid Bonding, Thermal Design, Package Reliability

Amazon

Preise von

18,10

Gesponserte Links

	18,10 €	Zum Shop
	18,10 €	Zum Shop
ALLE WEBSHOPS VERGLEICHEN (2)

Beschreibung

ADVANCED SEMICONDUCTOR PACKAGING FOR AI CHIPS: HBM Memory, Chiplet Integration, 2.5D and 3D Packaging, Hybrid Bonding, Thermal Design, Package Reliability

Webshops vergleichen (2)

Gesponserte Links · Einige Shops zahlen uns eine Vergütung

Sortieren nach:

18,10 € Gratis Versand

Beschreibung (0)

ADVANCED SEMICONDUCTOR PACKAGING FOR AI CHIPS: HBM Memory, Chiplet Integration, 2.5D and 3D Packaging, Hybrid Bonding, Thermal Design, Package Reliability