POWER SEMICONDUCTOR DEVICES and PACKAGING: Wide Bandgap Materials Thermal Management High Voltage Reliability

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POWER SEMICONDUCTOR DEVICES AND PACKAGING: Wide Bandgap Materials Thermal Management and High Voltage Reliability

Produktspezifikationen

Marken Independently Published
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  • 9798245492018

Preise zuletzt aktualisiert am:

Woodhead Publishing

Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability (Woodhead Publishing Series...

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Springer

Semiconductor Power Devices: Volume 2: Packaging, Thermal aspects, Reliability and Ruggedness

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CRC Press

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Woodhead Publishing

Wide Bandgap Semiconductor Power Devices: Materials, Physics, Design, and Applications (Woodhead Publishing...

146,50 €
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