Thermal Stress and Strain in Microelectronics Packaging

Name: Thermal Stress and Strain in Microelectronics Packaging
Brand: Springer
SKU: f19a2bb300ea7d884a620fb6b7336029

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Thermal Stress and Strain in Microelectronics Packaging

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Thermal Stress and Strain in Microelectronics Packaging

Marken	Springer
EAN	9781468477696

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Thermal Stress and Strain in Microelectronics Packaging John Lau Taschenbuch

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