Chiplets and Advanced Packaging: Die-to-Die Interconnect, 2.5D 3D Integration, Hybrid Bonding, Thermal Design for Multi-Die Systems

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Amazon Chiplets and Advanced Packaging: Die-to-Die Interconnect, 2.5D and 3D Integration, Hybrid Bonding, and Thermal Design for Multi-Die Systems
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Chiplets and Advanced Packaging: Die-to-Die Interconnect, 2.5D and 3D Integration, Hybrid Bonding, and Thermal Design for Multi-Die Systems

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EAN
  • 9798190431759

Springer

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets Heterogeneous Integration

174,35 €
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Independently Published

Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

93,30 €
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Independently Published

ADVANCED PACKAGING TECHNOLOGY FOR ELECTRONICS: thermal dissipation strategies and microassembly integration

11,96 €
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ADVANCED THERMAL MANAGEMENT FOR POWER SEMICONDUCTORS: Heat sink design packaging integration and reliability analysis

12,67 €
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