Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets Heterogeneous Integration

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Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets Heterogeneous Integration

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Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets Heterogeneous Integration

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Marken Springer
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  • 9789819641659

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Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

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